Radiation Analysis Thesis Internship

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/78d12w

Radiation analysis engineer thesis internship (Ref. CC-J-E-04)
Capsule Corporation is developing WaterCube, a modular water-based propulsion system for CubeSats and SmallSats. Backed by ESA BIC, CDP Venture Capital, and Takeoff Accelerator, we are preparing our first in-orbit demonstration in 2026. We invite enthusiastic near‑graduate Master’s students to join our team for a Master’s Thesis focused on radiation analysis of space avionics for LEO missions. The project will analyse and simulate the effects of the Low Earth Orbit (LEO) space environment on a microprocessor‑based propulsion control and power board, assessing the reliability and expected lifetime of its components over the mission duration. This role does not necessarily require previous experience in the aerospace industry; if your background is in automotive, robotics, or medical, and you want to contribute to scalable, sustainable space transportation, we want to hear from you.
What you will do
- Characterise the radiation environment in LEO (Total Ionizing Dose, Single Event Effects, displacement damage).




- Model the environment using dedicated simulation software (e.g., SPENVIS, OMERE, CREME96, Geant4).
- Analyse the radiation tolerance of microprocessor‑based avionics, including memory, power converters, and interface electronics.
- Simulate component degradation and identify lifetime limits for the system.
- Propose design and shielding optimisations to increase reliability.
- Work with the internal avionics team to integrate findings into the PCB design process.
- Document the analysis and present results internally and to institutional partners (ESA, ASI).

Mandatory Requirements
- MSc near graduate in Aerospace, Electronics, Engineering Physics, Physics, Nuclear Engineering or similar.
- Basic knowledge of space environment and radiation effects on electronics.
- Proficiency in Matlab/Octave or Python for data processing.
- Familiarity with microprocessor‑based PCB design or embedded systems.
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Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/78d12w