Advanced packaging engineer
Pubblicato il 01-08-2026 - TDK InvenSense in Italia
Join to apply for the Advanced Packaging Engineer - Staff role at TDK Inven Sense 3 days ago Be among the first 25 applicants Join to apply for the Advanced Packaging Engineer - Staff role at TDK Inven Sense Direct message the job poster from TDK Inven Sense Founded in 2003, Inven Sense Inc., a TDK Group Company, is the world's leading provider of MEMS sensor platforms. Inven Sense's vision of Sensing Everything targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. Inven Sense's motion tracking, audio and location platforms, and services can be found in many of the world's largest and most iconic brands including smartphones, tablets, wearables, drones, gaming devices, internet of things, automotive products, and remote controls for smart TVs.
Inven Sense is headquartered in San Jose, CA, and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy. We're looking for top-notch innovators to join our global team. If you're interested in being a part of our journey and helping us grow to become the leading provider of So C platform solutions, we want to hear from you. About the Role Work in the TDK Inven Sense Core Technology Packaging team providing leadership in the areas of package simulation and module level analysis supporting NPI assembly and technology development for all our motion products. The scope of work includes 3 D model generation, material characterization, mechanical simulations (static, dynamic, linear, non-linear analyses), thermal and thermomechanical simulations, electromagnetic and coupled Multiphysics simulations. You will be expected to work closely with MEMS design, assembly and v