Internship - Package Risk Analysis Optimization And Automation

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/78dphc

Responsibilities
- Work at the intersection of AI, data, and semiconductor R&D.;
- Contribute to a cutting‑edge Proof of Value (PoV).
- Explore how AI can support risk management and engineering decision‑making in practice.
- Develop an AI‑powered PoV for semiconductor package risk assessment.
- Work on a real industrial challenge: help engineers identify risks earlier, suggest mitigation actions and support validation planning for new semiconductor package developments.
- Combine knowledge retrieval, data science, machine learning, and real engineering data to build and test a smart workflow based on sparse historical information and reference projects.
- Main technology platform: Quad‑Flat‑No‑leads (QFN). Qualifications
- Bachelor or Master of Science.
- STEM studies focusing on data science, AI, and coding.
- Proficiency in English, both written and spoken.
- Python basics.
- Data science basics: data cleaning, Excel/CSV handling, document parsing, data mapping, AI/ML basics.




- Knowledge of AI tool development.

Soft Skills
- Proactivity
- Teamwork
- Problem solving
- Creativity
- Curious mindset
- Structured thinking

Nice to Have
- Python proficiency
- AI / ML proficiency
- AI tools portfolio
- FMEA basics knowledge
- Basic semiconductor knowledge
- Prompting basics
- SQL basics

DEI Statement

In ST, we are committed to promoting a diverse and inclusive working environment, have zero tolerance for discrimination. We aim to recruit and retain a diversified workforce that reflects the societies around us. We strive for equity in career development, opportunities, and fair pay. We encourage candidates who may not meet all requirements to apply, as we value diverse perspectives and provide opportunities for growth and learning.
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Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/78dphc