Internship - Thermal Characterization of Power Devices (Rth Measurements)

01 ago - Italia
Stmicroelectronics

OUR STORYAt STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.You will contribute to test improvement activities focused on the thermal characterization of power devices .



The goal of the internship is to develop and validate a robust measurement methodology for junction‑to‑case thermal resistance (Rth) on power packages, minimizing parasitic effects and ensuring both accuracy and repeatability of results.Main ResponsibilitiesPerform electrical and thermal measurements on power semiconductor packages (e.g. MOSFETs, IGBTs).Analyze and understand the influence of test conditions (mounting, boundary conditions, instrumentation, measurement sequences, etc.) on the measured Rth.Identify and reduce undesired effects and measurement artifacts (e.g. self‑heating dynamics, contact resistance, environmental influences).Propose, implement and validate an optimized measurement procedure for Rth, focused on:repeatability (short‑term and long‑term)measurement uncertainty and accuracyrobustness to operator and setup variationsProcess experimental data using basic statistics (repeatability, standard deviation, confidence intervals, comparison of methods).Document

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