31 lug - Italia
Microtech Global
ROLE: High Speed Signal Integrity Engineer
LOCATION: Milan, Italy
About the Role
We are working with a leading international R&D; organisation at the forefront of next-generation ICT hardware systems. Their advanced engineering team focuses on cutting-edge hardware technologies, with particular strength in high-speed interconnects, signal integrity (SI), and system-level performance optimisation.
This is an opportunity to take real ownership of signal integrity across the full design stack — from individual interconnects to complete system channels — while shaping the methodologies, tools, and workflows that enable high-performance, scalable hardware design.
What You'll Do
In this role, you will:
Own
end-to-end signal integrity analysis
for high-speed channels, from early design through to validation
Optimise
PCB, package, and interconnect performance
under real-world operating conditions
Develop and maintain
engineering tools, scripts, and automated workflows
to improve team efficiency and reproducibility
Build
reusable electromagnetic modelling methodologies
tailored to high-speed applications
Translate SI analysis into
clear, actionable design guidelines
that influence hardware development decisions
Contribute to and shape the
technical roadmap
for high-speed interconnects, integrating insights from industry and research
What We're Looking For
We're seeking engineers with strong fundamentals and a track record of delivering high-quality technical work.
You will typically bring:
A strong academic foundation in
Electrical Engineering, Physics, or a related field
, supported by an advanced degree and/or
5+ years of industry experience
Solid understanding of
signal integrity fundamentals
, including:
Interconnect modelling
Electromagnetic (EM) theory
Channel metrics (eye diagrams, crosstalk, BER, TDR)
Hands?on experience with
simulation tools
such as HFSS, ADS, CST, COMSOL, SIwave (or similar), with the ability to assess result accuracy and identify numerical artefacts
A
software engineering mindset
, with experience building tools or automation pipelines (e.g. Python), beyond ad-hoc scripting
Strong
communication skills in English
, including technical reporting and cross?functional collaboration
We also welcome candidates from adjacent domains (EM, RF, packaging, photonics, numerical modelling) who are motivated to specialise in signal integrity.
Nice to Have
Experience delivering SI results on
real high-speed hardware systems
Knowledge of
high-speed interfaces
(PCIe, Ethernet, DDR, SerDes)
Exposure to
statistical SI techniques
(Monte Carlo, corner analysis, DoE)
Background in
advanced packaging or chip-package co?design
Experience with
model order reduction, surrogate modelling, or ML applied to EM/SI problems
What's on Offer
Opportunity to work in a
high-impact R&D; environment
on next?generation technologies
A collaborative, technically driven team with strong growth potential
Competitive compensation package:
€60,000 – €75,000 base salary
(depending on experience)
Discretionary
annual premio (up to 2 months' salary)
Ongoing
training and career development opportunities
across Europe and internationally
Employment under
CCNL Telecommunications (Levels 6–7)
Diversity & Inclusion
Our client is committed to building an inclusive workplace and welcomes applications from all qualified candidates, regardless of background.
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