02 ago - Modena
Microtech Global
ROLE: High Speed Signal Integrity Engineer
LOCATION: Milan, Italy
About the Role
We are working with a leading international R&D; organisation at the forefront of next-generation ICT hardware systems. Their advanced engineering team focuses on cutting-edge hardware technologies, with particular strength in high-speed interconnects, signal integrity (SI), and system-level performance optimisation.
This is an opportunity to take real ownership of signal integrity across the full design stack — from individual interconnects to complete system channels — while shaping the methodologies, tools, and workflows that enable high-performance, scalable hardware design.
What You’ll Do
In this role, you will:
- Own end-to-end signal integrity analysis for high-speed channels, from early design through to validation
- Optimise PCB, package, and interconnect performance under real-world operating conditions
- Develop and maintain engineering tools, scripts, and automated workflows to improve team efficiency and reproducibility
- Build reusable electromagnetic modelling methodologies tailored to high-speed applications
- Translate SI analysis into clear, actionable design guidelines that influence hardware development decisions
- Contribute to and shape the technical roadmap for high-speed interconnects, integrating insights from industry and research
What We’re Looking For
We’re seeking engineers with strong fundamentals and a track record of delivering high-quality technical work.
You will typically bring:
- A strong academic foundation in Electrical Engineering, Physics, or a related field , supported by an advanced degree and/or 5+ years of industry experience
- Solid understanding of signal integrity fundamentals , including:
- Interconnect modelling
- Electromagnetic (EM) theory
- Channel metrics (eye diagrams, crosstalk, BER, TDR)
- Hands‑on experience with simulation tools such as HFSS, ADS, CST, COMSOL, SIwave (or similar), with the ability to assess result accuracy and identify numerical artefacts
- A software engineering mindset , with experience building tools or automation pipelines (e.g. Python), beyond ad-hoc scripting
- Strong communication skills in English , including technical reporting and cross‑functional collaboration
We also welcome candidates from adjacent domains (EM, RF, packaging, photonics, numerical modelling) who are motivated to specialise in signal integrity.
Nice to Have
- Experience delivering SI results on real high-speed hardware systems
- Knowledge of high-speed interfaces (PCIe, Ethernet, DDR, SerDes)
- Exposure to statistical SI techniques (Monte Carlo, corner analysis, DoE)
- Background in advanced packaging or chip-package co‑design
- Experience with model order reduction, surrogate modelling, or ML applied to EM/SI problems
What’s on Offer
- Opportunity to work in a high-impact R&D; environment on next‑generation technologies
- A collaborative, technically driven team with strong growth potential
- Competitive compensation package:
- €60,000 – €75,000 base salary (depending on experience)
- Discretionary annual premio (up to 2 months’ salary)
- Ongoing training and career development opportunities across Europe and internationally
- Employment under CCNL Telecommunications (Levels 6–7)
Diversity & Inclusion
Our client is committed to building an inclusive workplace and welcomes applications from all qualified candidates, regardless of background.
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