Group 08-35 | Microfabrication Engineering Co-Op | Microelectronics Laboratory | Jan - Aug 2027
Pubblicato il 01-08-2026 - Mit Lincoln Laboratory in Italia
Microfabrication Engineering Co-Op
The Microelectronics Laboratory is seeking students eager to apply their science and engineering skills in the US Government's most capable wafer fabrication facility. Successful candidates will create and improve wafer fabrication processes by designing, running and analyzing experiments, and implementing improvements in support of national security interests. Our facility supports the fabrication of state-of-the-art superconducting circuits, quantum computing circuits, radiation hardened electronics, rf devices, integrated photonics, and charge coupled imagers. Potential focus areas include: photolithography, reactive ion etching, plasma enhanced chemical vapor deposition, physical vapor deposition, wafer bonding, wet chemical processing, and ion implantation.
An undergraduate background in physics, chemistry, materials science, engineering or statistics and a willingness to work in a cleanroom are key requirements. Candidates must also have enthusiasm for solving problems,
an interest in teaming, and US citizenship.
Compensation for ****
(will be reviewed for ****)
Technical Co-Op:
$***** – $***** per hour (based on year in school)
Administrative Co-Op:
$***** – $***** per hour (based on year in school)
Selected candidate will be subject to a pre-employment background investigation and must be able to obtain and maintain a Secret level DoD security clearance.
MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.
Requisition ID:
*****