02 ago - Modena
Microtech Global
ROLE: High Speed Signal Integrity Engineer
LOCATION: Milan, Italy
About the RoleWe are working with a leading international R&D; organisation at the forefront of next-generation ICT hardware systems.
Their advanced engineering team focuses on cutting-edge hardware technologies, with particular strength in high-speed interconnects, signal integrity (SI), and system-level performance optimisation.
This is an opportunity to take real ownership of signal integrity across the full design stack — from individual interconnects to complete system channels — while shaping the methodologies, tools, and workflows that enable high-performance, scalable hardware design.
What You'll DoIn this role, you will:
Ownend-to-end signal integrity analysisfor high-speed channels, from early design through to validation
OptimisePCB, package, and interconnect performanceunder real-world operating conditions
Develop and maintainengineering tools, scripts, and automated workflowsto improve team efficiency and reproducibility
Buildreusable electromagnetic modelling methodologiestailored to high-speed applications
Translate SI analysis intoclear, actionable design guidelinesthat influence hardware development decisions
Contribute to and shape thetechnical roadmapfor high-speed interconnects, integrating insights from industry and research
What We're Looking ForWe're seeking engineers with strong fundamentals and a track record of delivering high-quality technical work.
You will typically bring:
A strong academic foundation inElectrical Engineering, Physics, or a related field, supported by an advanced degree and/or5+ years of industry experience
Solid understanding ofsignal integrity fundamentals,
including:Interconnect modelling
Electromagnetic (EM) theory
Channel metrics (eye diagrams, crosstalk, BER, TDR)
Hands?on experience withsimulation toolssuch as HFSS, ADS, CST, COMSOL, SIwave (or similar), with the ability to assess result accuracy and identify numerical artefacts
Asoftware engineering mindset, with experience building tools or automation pipelines (e.g. Python), beyond ad-hoc scripting
Strongcommunication skills in English, including technical reporting and cross?functional collaboration
We also welcome candidates from adjacent domains (EM, RF, packaging, photonics, numerical modelling) who are motivated to specialise in signal integrity.
Nice to HaveExperience delivering SI results onreal high-speed hardware systems
Knowledge ofhigh-speed interfaces(PCIe, Ethernet, DDR, SerDes)
Exposure tostatistical SI techniques(Monte Carlo, corner analysis, DoE)
Background inadvanced packaging or chip-package co?design
Experience withmodel order reduction, surrogate modelling, or ML applied to EM/SI problems
What's on OfferOpportunity to work in ahigh-impact R&D; environmenton next?generation technologies
A collaborative, technically driven team with strong growth potential
Competitive compensation package:€60,000 – €75,000 base salary(depending on experience)
Discretionaryannual premio (up to 2 months' salary)
Ongoingtraining and career development opportunitiesacross Europe and internationally
Employment underCCNL Telecommunications (Levels 6–7)
Diversity & InclusionOur client is committed to building an inclusive workplace and welcomes applications from all qualified candidates, regardless of background.
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