Signal Integrity Engineer
Pubblicato il 04-08-2026 - Microtech Global in Italia
ROLE: High Speed Signal Integrity Engineer
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LOCATION: Milan, Italy
About the Role
We are working with a leading international R&D; organisation at the forefront of next-generation ICT hardware systems. Their advanced engineering team focuses on cutting-edge hardware technologies, with particular strength in high-speed interconnects, signal integrity (SI), and system-level performance optimisation.
This is an opportunity to take real ownership of signal integrity across the full design stack — from individual interconnects to complete system channels — while shaping the methodologies, tools, and workflows that enable high-performance, scalable hardware design.
What You’ll Do
In this role, you will:
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- Own end-to-end signal integrity analysis for high-speed channels, from early design through to validation
- Optimise PCB, package, and interconnect performance under real-world operating conditions
- Develop and maintain engineering tools, scripts, and automated workflows to improve team efficiency and reproducibility
- Build reusable electromagnetic modelling methodologies tailored to high-speed applications
- Translate SI analysis into clear, actionable design guidelines that influence hardware development decisions
- Contribute to and shape the technical roadmap for high-speed interconnects, integrating insights from industry and research
What We’re Looking For
We’re seeking engineers with strong fundamentals and a track record of delivering high-quality technical work.
You will typically bring:
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- A strong academic foundation in Electrical Engineering, Physics, or a related field, supported by an advanced degree and/or 5+ years of industry experience
- Solid understanding of signal integrity fundamentals, including:
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- Interconnect modelling
- Electromagnetic (EM) theory
- Channel metrics (eye diagrams, crosstalk, BER, TDR)
- Hands‑on experience with simulation tools such as HFSS, ADS, CST, COMSOL, SIwave (or similar), with the ability to assess result accuracy and identify numerical artefacts
- A software engineering mindset, with experience building tools or automation pipelines (e.g. Python), beyond ad-hoc scripting
- Strong communication skills in English, including technical reporting and cross‑functional collaboration
We also welcome candidates from adjacent domains (EM, RF, packaging, photonics, numerical modelling) who are motivated to specialise in signal integrity. xysqume
Nice to Have
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- Experience delivering SI results on real high-speed hardware systems
- Knowledge of high-speed interfaces (PCIe, Ethernet, DDR, SerDes)
- Exposure to statistical SI techniques (Monte Carlo, corner analysis, DoE)
- Background in advanced packaging or chip-package co‑design
- Experience with model order reduction, surrogate modelling, or ML applied to EM/SI problems
What’s on Offer
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- Opportunity to work in a high-impact R&D; environment on next‑generation technologies
- A collaborative, technically driven team with strong growth potential
- Competitive compensation package:
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- €60,000 – €75,000 base salary (depending on experience)
- Discretionary annual premio (up to 2 months’ salary)
- Ongoing training and career development opportunities across Europe and internationally
- Employment under CCNL Telecommunications (Levels 6–7)
Diversity & Inclusion
Our client is committed to building an inclusive workplace and welcomes applications from all qualified candidates, regardless of background.
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