Wafer/Package Level Testing Engineer

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Experteer Overview In this role you will support the reliability and qualification work for power device technologies (SiC, IGBT, GaN) through planning, execution, data analysis, and reporting at wafer/package level. You will engage in early MOSFET device physics evaluation and help identify weaknesses in out-of-spec scenarios to drive technology qualification. You will operate within a cross-functional environment to advance prototypes and bench characterization of power devices.

This opportunity lets you contribute to a sustainable and innovative roadmap in power electronics at STMicroelectronics.

Responsibilities Plan, execute, monitor, and report on wafer/package level tests for electrical wafer sorting/final test in reliability studies Analyze data from prototypes of discrete power technologies (SiC, IGBT, GaN)



and bench characterization Evaluate early MOSFET device physics and electrical static performances Identify weaknesses in out-of-spec results and contribute to resolving technology issues Support technology qualification activities and communicate findings to cross-functional teams Qualifications Master degree in physics, material science or electrical/physical engineering 2 years of experience Knowledge of reliability physics, semiconductor physics, electronic devices, and electrical characterization methods Good written and spoken English Programming and numerical modeling skills are highly appreciated Problem-solving attitude and teamwork Salary and Benefits salary range 38,000 – 45,000 gross annual salary (RAL) variable pay related to role CCNL-based offer focus on equal pay and equal opportunities DEI-friendly workplaceglobal, diverse team

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/7asr3y