07 ago - Italia
Elettrotecnica
We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross‐functional execution from concept through high‐volume manufacturing.
Responsibilities Lead development, optimization, and implementation of GaN packaging and assembly processes.
Define package architectures aligned with performance, reliability, and cost targets.
Collaborate cross‐functionally (R&D;, design, production, quality, purchasing) for seamless transfer to manufacturing.
Specify, select, and qualify equipment, materials, and tooling.
Develop and maintain process documentation, specifications, and engineering change records.
Provide technical expertise to troubleshoot manufacturing issues and lead root‐cause analysis.
Manage supplier qualification and support technology transfer for outsourced processes.
Drive yield, quality, and continuous improvement using SPC and data‐driven methodologies.
Qualifications Bachelor's or Master's degree in Mechanical Engineering, Microelectronics, Materials Science, Physics, or related field.
Strong experience in semiconductor backend R&D; and manufacturing, including assembly and packaging.
Solid understanding of semiconductor backend processes and connection technologies.
Knowledge of GaN packaging, device characteristics, and related manufacturing challenges (advantageous).
Familiarity with measurement systems, industry standards, and best practices.
Strong analytical skills, including data interpretation, root‐cause analysis, and Six Sigma methodologies.
Effective communication skills with a collaborative, cross‐functional mindset.
Results‐driven, quality‐focused, with the ability to manage multiple priorities independently.
About Nexperia Nexperia is a global leader in semiconductor components, powering essential electronics across automotive, industrial, mobile, an
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