R&D Packaging Development Manager
Pubblicato il 07-08-2026 - Altro in Italia
R&D; Packaging Development Manager – GxP (Trieste)
Annual Gross Salary Pay Range 56,300 € – 70,434 € B2-A2 Chemical Pharmaceutical CLA level
This role is responsible for leading the end‐to‐end development and lifecycle management of packaging systems within a GxP‐regulated environment, ensuring compliance with relevant regulations, quality standards, and business requirements.
You will work across the full product lifecycle, from early development through to commercial manufacturing and technology transfer, ensuring packaging solutions are compliant, robust, and fit for purpose within a regulated environment.
This role requires strong collaboration with Quality, Regulatory Affairs, Manufacturing, Product teams, and external suppliers to ensure compliant, robust, and scalable packaging solutions that meet GMP and broader GxP requirements.
This role is suited to a professional with 3–5 years of experience looking to deepen technical expertise and take ownership of defined projects or workstreams within a global environment.
Key Responsibilities
Led and delivered end‐to‐end development of GxP‐regulated packaging systems, progressing concepts through validation and commercialisation to ensure robust, compliant product launches
Defined and implemented packaging specifications and acceptance criteria, ensuring alignment with regulatory requirements, product performance, and quality standards
Developed and executed packaging validation strategies (DQ/IQ/OQ/PQ), generating data to support regulatory submissions and ensure manufacturing readiness
Resolved complex packaging and manufacturing challenges, identifying root causes and implementing effective solutions to improve performance and reliability
Authored and managed GxP documentation (protocols, reports, specifications), ensuring full compliance and audit readiness across development and lifecycle stages
Collaborated with suppliers, CMOs, and cross‐functional teams to deliver successful scale‐up, technology transfer, and