Mechanical engineer space electronics assemblies
Pubblicato il 09-08-2026 - Aresys in Italia
Location: Milan, Italy Job Type: Full-time About ARESYS ARESYS is an Italian SME providing innovative satellite-based sensing solutions to the Space and Defense markets. ARESYS offers 20+ years of expertise in designing and developing on-board and on-ground systems with a vertical specialization in microwawe (Radar, SAR) and Optical technologies. Role Overview We are seeking a skilled Mechanical Engineer to join our team and contribute to the design and integration of mechanical structures for space electronic assemblies, including housings, enclosures, thermal interfaces, mechanical supports, and brackets. The ideal candidate will have hands‐on experience in the design of hardware for harsh environments (space vacuum, vibration, thermal extremes) and will work in close collaboration with electronics, thermal, and systems engineering teams. Responsibilities 3 D 2 D mechanical design of structures and interfaces for space‐grade electronic units (boxes, heatsinks, mounting interfaces, connector panels, etc.). Creation of mechanical drawings and technical documentation (Bo Ms,
manufacturing drawings, tolerances, DFM considerations). Collaboration with electronic designers to ensure proper mechanical and thermal integration of PCBs, connectors, and shields. Material selection and specification of finishes treatments suitable for space (e.g., low‐outgassing, CTE compatibility, corrosion resistance). Liaising with suppliers, mechanical workshops, and prototyping partners. Participation in environmental testing campaigns (vibration, TVAC, shock), including mechanical test setup preparation. Contribution to technical design reviews (PDR, CDR) and product configuration control. Qualifications Familiarity with space‐related norms and standards (ECSS preferred). Proficient in 3 D CAD modeling and 2 D drawing generation. Basic knowledge of structural and thermal simulation tools (FEA/FEM). Understanding of thermal, EMC, and mechanical constraints in electronic packaging. Experi