Field Applications Development Program
Pubblicato il 12-08-2026 - Texas Instruments in Vimercate
Field Applications Development Program - Vimercate, ItaliaItaly
Job DescriptionChange the world. Love your job.
When you join TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job.
TI's FAST (Field Applications & Sales Training) Program is designed to prepare Sales & Applications team members for customer-oriented careers that pair technical skills with business perspectives. The program provides experiences that help rising TIers understand how to successfully grow TI's business and to thrive throughout their entire TI career. There are two available FAST program tracks: (1) Field Applications and (2) Technical Sales.
This 11-month experience aims to establish rising Field Applications Engineers (FAEs) as technical TI experts with customer engineers and internal teams. The track includes two 6-month rotations*:
Rotation 1, Field Sales Office (FSO): The FSO rotation is centered on learning how to work directly with customers to solve technical challenges, and to ultimately maximize TI's revenue by providing customers with the systems-level solutions that best address their design needs. Among other aspects, the FSO rotation focuses on analyzing technical trade-offs, understanding component selection, and solving design and cost challenges.
Rotation 2, Systems Engineering & Marketing (SEM): The SEM rotation provides hands-on experiences that help future FAEs understand how various TI components fit together to provide systems-level solutions for customer designs. This rotation focuses on technical product selection, schematic/layout capture, PCB layouts, fabrication processes, b