Photonics Packaging Engineer
Pubblicato il 13-08-2026 - Advanced Fiber Resources in Roma
AFR is investing in its PIC business by expanding the R&D; and Manufacturing Center in San Donato Milanese.
Possiede le competenze, l'esperienza e la determinazione necessarie per avere successo in questo ruolo? Lo scopra qui sotto.
We are looking for an expert Packaging Engineer to join our growing development team. You will have the opportunity to work with skillful and highly motivated engineers developing thin film Lithium Niobate products for telecom, datacom and quantum photonics applications.
Job Responsibilities:
Develop advanced electro-optical components and modules, with a focus on photonic and high-speed RF packaging solutions.
Resolve technical challenges related to optical coupling, thermal management, and high-frequency electrical interconnects.
Work closely with NPI engineers to develop automated manufacturing processes and test workstations.
Contribute throughout all development phases, from concept definition and prototyping through product development, qualification, and manufacturing.
Collaborate with internal teams and external suppliers to define technical requirements, specifications, and procurement requirements.
Act as the company's mechanical design authority, establishing and promoting best practices across projects and product lines.
Define project plans and technical deliverables to meet development schedules.
Provide regular technical and project-status updates to management. xbvzest
Perform assigned responsibilities with a high degree of independence and under limited supervision.
Job Requirements:
At least 5 years of professional experience in similar roles within a relevant industry
Proven experience in the design and development of optical and electro-optical modules
Proficiency in 3D modeling and CAD software, such as SolidWorks, Creo, or equivalent tools
Solid understanding of photonics principles and devices, including optical modulators
Good knowledge of backend assembly processes, including soldering, adhesive bonding, thermal