Staff MEMS Packaging Engineer: Lead Simulations

13 ago - Assago
TDK InvenSense

A global semiconductor company in Assago is seeking an Advanced Packaging Engineer Non aspetti a candidarsi dopo aver letto questa descrizione: per questa possibilità è previsto un elevato volume di candidature. - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. xivgfpx This full-time role supports innovation in a dynamic environment.

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