13 ago - Italia
Mit Lincoln Laboratory
The Advanced Imager Technology Group develops imaging platforms that enable impactful national security capabilities and scientific discovery. From fundamental device research to developing camera technology for fielded systems, our group covers the full technology development spectrum from concept to prototype. Research areas include novel imager and detector design with in-house silicon and compound semiconductor microfabrication facilities, leading-edge integrated circuit design, and advanced packaging and 3D integration capabilities. Examples of our technology include large-format focal planes, high-speed imagers, time-of-arrival detectors (LADAR receivers), and low-light-level imagers. The group's efforts span the range of device and materials development, integrated circuit design and fabrication, custom packaging, detector hybridization, and the development of control and readout electronics for system-level demonstrations.
Job Description
The Advanced Imager Technology Group is seeking to hire a Technical Staff member to develop next generation readout integrated circuit architectures as part of the group’s portfolio of imager technology. Current research areas include designs in advanced technology nodes (< 32 nm) and on-chip digital processing and reconfigurable logic. The position requires broad knowledge of integrated design techniques and tools from concept development and modeling to physical implementation and tapeout.
The candidate will be a member of a design team and must value teamwork, collaboration, and creative thinking. The design team fits within a larger vertically integrated team whose goal is to develop imaging systems for a wide variety of applications. The successful applicant must have a growth mindset with an expectation for continuous improvement of self and others through shared learning.
Requirements
Candidates should have a deep expertise in at least two of the following areas:
- Digital IC design
- Industry standard IC design
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