We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.
Technical expert responsible for physical implementation of high-speed digital and mixed-signal blocks for communication ICs
Own place-and-route implementation activities
Define physical design methodologies
Optimize PPA,

timing closure and signal integrity
Coordinate implementation sign-off
Support tape-out execution
MSc in Electrical Engineering
10+ years physical design experience
Place-and-route tools
STA and physical verification
Floorplanning, CTS, IR-drop and EM analysis
Advanced CMOS node experience, including FinFET and/or FD-SOI, is required
Physical implementation experience for high-speed digital or mixed-signal ICs is required; implementation awareness of high-speed interfaces such as UCIe, PCIe or similar protocols is an advantage
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Principal Hs Digital Place & Route Engineer (D/M/F)

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