Backfill it support engineer
Pubblicato il 19-08-2026 - TECEZE in Lombardia
Hiring: EUC / Deskside Support Engineer – EMEA | Backfill Opportunity We are looking for experienced EUC / Deskside Support Engineers with strong hands‐on experience in IT Service Management, Desktop Support, End User Computing, and infrastructure troubleshooting . • 3–4+ years of experience in IT Service Management / EUC / Deskside Support • Strong hands‐on experience in Desktop / End User Computing support • Knowledge of infrastructure components and desktop hardware • Hands‐on experience assembling/re‐seating RAM, SSD, screens, WLAN cards, keyboards, motherboards , etc. • System recalibration and hardware sanitization/maintenance • Experience with SCCM / Ivanti / Microsoft Intune for software deployments and installations • Experience with Windows OS installation, configuration and troubleshooting • Knowledge of patching, package installation and troubleshooting • Experience supporting conference room / meeting room devices , including: Polycom Cisco Star Leaf Microsoft Teams Rooms Touch panels Monitors Experience with remote support tools such as RDP, i DRAC,
i LO and related tools Printer troubleshooting and file restoration experience Experience managing Antivirus, Windows patches, feature packs and endpoint updates Experience managing the complete laptop lifecycle – imaging, allocation, de-allocation, reclamation and inventory tracking Knowledge of ITSM tools and processes Experience working in a Managed Service environment Strong understanding of ITIL Service Management processes Good stakeholder management and customer service skills Excellent English communication and analytical skills • Laptop stock and inventory management • Asset tracking and maintaining accurate records in ITSM platforms • Software installation and deployment • Profile archiving and space reclamation • Coordination with Facilities teams for non-network devices • Troubleshooting end-user devices and infrastructure-related issues • Supporting regional IT operations and ensuring SLA adher