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Signal Integrity Engineer

Pubblicato il 23-08-2026 - Microtech Global in Italia

ROLE: High Speed Signal Integrity Engineer

LOCATION: Milan, Italy

About the Role

We are working with a leading international R&D; organisation at the forefront of next-generation ICT hardware systems. Their advanced engineering team focuses on cutting-edge hardware technologies, with particular strength in high-speed interconnects, signal integrity (SI), and system-level performance optimisation.

This is an opportunity to take real ownership of signal integrity across the full design stack — from individual interconnects to complete system channels — while shaping the methodologies, tools, and workflows that enable high-performance, scalable hardware design.

What You’ll Do

In this role, you will:

- Own end-to-end signal integrity analysis for high-speed channels, from early design through to validation
- Optimise PCB, package, and interconnect performance under real-world operating conditions
- Develop and maintain engineering tools, scripts, and automated workflows to improve team efficiency and reproducibility
- Build reusable electromagnetic modelling methodologies tailored to high-speed applications
- Translate SI analysis into clear, actionable design guidelines that influence hardware development decisions
- Contribute to and shape the technical roadmap for high-speed interconnects, integrating insights from industry and research

What We’re Looking For

We’re seeking engineers with strong fundamentals and a track record of delivering high-quality technical work.

You will typically bring:

- A strong academic foundation in Electrical Engineering, Physics, or a related field , supported by an advanced degree and/or 5+ years of industry experience
- Solid understanding of signal integrity fundamentals , including:




- Interconnect modelling
- Electromagnetic (EM) theory
- Channel metrics (eye diagrams, crosstalk, BER, TDR)

- Hands‑on experience with simulation tools such as HFSS, ADS, CST, COMSOL, SIwave (or similar), with the ability to assess result accuracy and identify numerical artefacts
- A software engineering mindset , with experience building tools or automation pipelines (e.g. Python), beyond ad-hoc scripting
- Strong communication skills in English , including technical reporting and cross‑functional collaboration

We also welcome candidates from adjacent domains (EM, RF, packaging, photonics, numerical modelling) who are motivated to specialise in signal integrity.

Nice to Have

- Experience delivering SI results on real high-speed hardware systems
- Knowledge of high-speed interfaces (PCIe, Ethernet, DDR, SerDes)
- Exposure to statistical SI techniques (Monte Carlo, corner analysis, DoE)
- Background in advanced packaging or chip-package co‑design
- Experience with model order reduction, surrogate modelling, or ML applied to EM/SI problems

What’s on Offer

- Opportunity to work in a high-impact R&D; environment on next‑generation technologies
- A collaborative, technically driven team with strong growth potential
- Competitive compensation package:
- €60,000 – €75,000 base salary (depending on experience)
- Discretionary annual premio (up to 2 months’ salary)

- Ongoing training and career development opportunities across Europe and internationally
- Employment under CCNL Telecommunications (Levels 6–7)

Diversity & Inclusion

Our client is committed to building an inclusive workplace and welcomes applications from all qualified candidates, regardless of background.

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