INTERN NAND Process Integration Engineer

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/7iqd2r

Develop and refine structural models of 3D NAND arrays to anticipate mechanical stress and reliability concerns. Provide baseline array models to support TCAD-driven electrical simulations (e.g., capacitance, E-field). Analyze layout proposals and contribute to early-stage design rule definitions. Collaborate with structural CAD team, providing input structures at the aim to collect and benchmark mechanical outputs parameters vs option Collaborate with cross-functional teams including TCAD, Process Integration, and Design Engineering. Document modeling results and present findings to engineering stakeholders. Currently pursuing (or graduated) a Master's degree (MSc) in: Physics or Material Sciences Structural Engineering Engineering Physics Electronics Engineering

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/7iqd2r