25 ago - Italia
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment. #J-18808-Ljbffr
26 ago - Bari
jamboeventi
26 ago - Pisa
Sentra Energia
26 ago - Desio
GruppoSanitalia
26 ago - Nettuno
Proemozioni group