Process Engineering -ag300 Dry Etch Area

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/7jasxa

**OUR STORY** At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today. When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+ diverse and dedicated creators & makers of technology around the world! Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation - whilst unlocking your own potential. Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future! The work location will be the new semiconductor manufacturing and technology 300mm (12”) microelectronics products mass production wafer fab, AG300, based in Agrate Brianza. The plant was started in 2021 and is now ramping up in volumes; it features the latest generation of equipment and a very high level of automation. The new fab represents one of the largest technological investments in Italy, and has a total surface area of 65,000 square meters of which 15,000 are clean rooms Your main tasks as a Process Engineer will be to optimize and improve the efficiency of manufacturing equipment and industrial processes, special focus in next period will be on the start-up and qualification of equipment and processes to support the capacity ramp-up. **Short area introduction**:




Dry etching is a vital technique in microchip fabrication that involves removing material from a substrate using reactive plasmas. Unlike wet etching, which uses liquid chemicals, dry etching employs ionized gases to form plasma. This plasma reacts with the substrate material, allowing for precise and controlled etching. The technique is essential for creating intricate patterns and fine features in microchips, offering high precision and anisotropic etching capabilities. Its scalability makes it ideal for large-scale production, making dry etching indispensable in the semiconductor industry. **Area specific competencies**: - Plasma physics, vacuum physics
- Chemical kinetics, materials science **YOUR ROLE** The main objectives of the position are: - Guarantee tool uptime and tool performance aligned to targets
- Ensure process robustness and stability
- Definition and management of equipment control chart
- Definition, management and training for OCAP
- Management of hold lots, tool alarms and FDC
- New tool selection, Equipment Procurement Specification definition and tool start-up
- Improve tool and process performances in term of COO, defectivity, OEE, MTBC,...
- Develop new processes according to device/proc.dev group requirements **YOUR SKILLS & EXPERIENCES**
- Scientific degree or Ph.D. in Physics, Material Science, Chemistry, Engineering or similar
- English Knowledge
- Scientific approach
- Strong problem solving ability
- Flexibility in priorities management
- Team work abilityStatistical skills Joining us is also about a greater work-life balance and workplace with equal opportunities. Dedicated Employee Resource Groups for women and LGBTQIA+, hybrid work arrangements are amongst the many DEI & Sustainability initiatives that make us a great place to evolve your career.

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/7jasxa