We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

Legga la panoramica di questa possibilità per capire quali competenze sono richieste, incluse le soft skill pertinenti e la padronanza di pacchetti software.

Technical leader responsible for HF analog layout strategy for broadband optical communication ICs or comparable RF ICs

Lead layout architecture and floorplanning activities

Develop and enforce layout methodologies

Drive parasitic-aware implementations

Support design teams through sign-off

Mentor layout engineers

BSc or MSc in Electrical Engineering

10+ years RF/analog xlwpduy layout experience

HF analog layout for broadband optical communication ICs or comparable RF ICs, including high-speed receiver/transmitter interfaces

Matching, shielding and isolation

Advanced CMOS node experience, including FinFET and/or FD-SOI, is required

EM-aware layout methodologies

Principal RF/HF Analog Layout Engineer

Maestra

Bagnino

Ricevi nuove offerte di lavoro

Economo Ristorazione

Shampista e colorista