Photonics Packaging Engineer

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/7lexwk

AFR is investing in its PIC business by expanding the R&D; and Manufacturing Center in San Donato Milanese.We are looking for an expert Packaging Engineer to join our growing development team. You will have the opportunity to work with skillful and highly motivated engineers developing thin film Lithium Niobate products for telecom, datacom and quantum photonics applications. Our commitment:Innovative work environment in a young, dynamic team Additional benefits: € 9/day of buoni pasto; health fund covering medical expenses; employee welfare platform

Tutte le competenze, le qualifiche e l'esperienza necessarie per un candidato di successo sono elencate nella seguente descrizione.
Job Responsibilities

- Develop advanced electro-optical components and modules, with a focus on photonic and high-speed RF packaging solutions
- Resolve technical challenges related to optical coupling, thermal management, and high-frequency electrical interconnects
- Work closely with NPI engineers to develop automated manufacturing processes and test workstations
- Contribute throughout all development phases, from concept definition and prototyping through product development, qualification, and manufacturing
- Collaborate with internal teams and external suppliers to define technical requirements, specifications, and procurement requirements.
- Act as the company’s mechanical design authority,



establishing and promoting best practices across projects and product lines.
- Define project plans and technical deliverables to meet development schedules. xysqume
- Provide regular technical and project-status updates to management.

Job Requirements
- At least 5 years of professional experience in similar roles within a relevant industry
- Proven experience in the design and development of optical and electro-optical modules
- Proficiency in 3D modeling and CAD software, such as SolidWorks, Creo, or equivalent tools
- Solid understanding of photonics principles and devices, including optical modulators
- Good knowledge of backend assembly processes, including soldering, adhesive bonding, thermal curing, and UV curing
- Ability to work effectively in an international, cross-functional team environment and collaborate with employees at all organizational levels
- Nice to have: experience with Python scripting for data analysis, simulations or test development
- Strong communication and interpersonal skills, with a collaborative and team-oriented approach
- Fluency in English, both written and spoken

Compensation

Compensation range: € 40.000-€ 55.000 based on experience

Additional Benefits

- € 9/day of ticket restaurant;
- health fund covering medical expenses;
- employee welfare platform

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Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/7lexwk