31 ago - Bardi
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff.
You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams.
Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging.
Strong communication and knowledge of semiconductor materials are essential.
This full-time role supports innovation in a dynamic environment.br#J-*****-Ljbffr
02 set - Ascoli Piceno
Visibilia Group
02 set - Palermo
Salvatore Bonura
02 set - Montalto Uffugo
master call srls
02 set - Reggio Calabria
Ristorante Da Mimmo