02 set - Assago
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.
03 set - Bergamo
Fidelitas S. P. A.
03 set - Italia
Mynameis
03 set - Caserta
TELUS Digital AI Data Solutions
03 set - Udine
Gi Group SpA Filiale di Udine