03 set - Bardi
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.
05 set - Roma
Saturno Casa
05 set - Roma
P&G Group di Palamenghi e Garuti
05 set - Roma
Studio Bravetta Pisana
05 set - Brindisi
TSMG Holding