06 set - Assago
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.br#J-18808-Ljbffr
07 set - Milano
Mind The Value
07 set - Curtarolo
eBa Ricerca & Selezione
07 set - Massa
Disoccupazione
07 set - Roma
Tempi Moderni Helvetia