07 set - Italia
ams OSRAM
We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.
- Lead bring-up and validation of RF, HF, analog, mixed-signal, and high-speed digital ICs
- Develop and execute validation plans to verify compliance with product specifications
- Characterize device performance across process, voltage, and temperature conditions
- Drive root-cause analysis and resolution of silicon issues
- Define validation methodologies, measurement strategies, and best practices
- Support design reviews and provide technical guidance during product development
- Establish correlation between simulations, models, and silicon measurements
- Analyze system-level performance including signal integrity, jitter, BER, noise, power consumption, and reliability
- Collaborate with architecture, design, verification, layout, packaging, product engineering, and manufacturing teams
- Support customer evaluations, qualification activities, and technical presentations
- Mentor junior validation and test engineers
- Master’s degree in Electrical Engineering, Electronics Engineering, Applied Physics, or a related discipline
- 8+ years of experience in semiconductor validation, characterization, test, or product engineering
- Proven track record supporting successful IC developments from first silicon through production
- Broadband optical communication systems and IC validation, including high-speed optical links, SerDes-based interfaces, and mixed-signal subsystems
- RF, HF, analog,
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