We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

Per candidarsi, è sufficiente leggere la seguente descrizione del lavoro e assicurarsi di allegare i documenti pertinenti.

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- Technical leader responsible for HF analog layout strategy for broadband optical communication ICs or comparable RF ICs
- Lead layout architecture and floorplanning activities
- Develop and enforce layout methodologies
- Drive parasitic-aware implementations
- Support design teams through sign-off
- Mentor layout engineers

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- BSc or MSc in Electrical Engineering
- 10+ years RF/analog layout xysqume experience
- HF analog layout for broadband optical communication ICs or comparable RF ICs, including high-speed receiver/transmitter interfaces
- Matching, shielding and isolation
- Advanced CMOS node experience, including FinFET and/or FD-SOI, is required
- EM-aware layout methodologies

Principal RF/HF Analog Layout Engineer

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