09 set - Catania
Nexperia
We are seeking a Principal Engineer – GaN Package Development to develop and industrialize advanced packaging technologies for GaN power devices and modules. You will drive package architecture, ensure performance, reliability, and cost targets, and lead cross-functional execution from concept through high-volume manufacturing.
This is your new job:
Lead development, optimization, and implementation of GaN packaging and assembly processes
Define package architectures aligned with performance, reliability, and cost targets
Collaborate cross-functionally (R&D;, design, production, quality, purchasing) for seamless
10 set - Italia
ATTAL Group
10 set - Italia
Loro Piana
10 set - Pavia
Mavriq
10 set - Italia
Modulo Group