Dry etch process engineer

09 set - Agrate Brianza
STMicroelectronics Italia

OUR STORY

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.

When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world

Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future

YOUR ROLE

We are seeking a motivated and passionate intern with a degree, preferably in Physics, Materials Engineering, Nanotechnology, or Chemistry,



to join our research and development team specializing in dry etching. The candidate will gain hands-on experience with advanced plasma etching techniques and contribute to process optimization.

The Key Responsibilities Will Be

Assist in the installation and qualification of new dry etching tools.
Provide technical support to production to ensure process stability and quality
Analyze process results using characterization tools (e.g., SEM, ellipsometry, XSEM, XTEM).
Document findings and assist in preparing technical reports.
Support the team in developing and optimizing dry etching processes.

What We Offer is the opportunity to learn advanced dry etching techniques, a dynamic and innovative work environment and a Mentorship from industry experts.

Your Skills & Experiences

University degree in Physics, Materials Engineering, Nanotechnology, Chemistry, or related fields.
Basic knowledge of microfabrication processes and etching techni

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