11 set - Milano
Informatica / Software
Bending Spoons is inviting outstanding students to an internship from June to September 2027, offering hands-on work that reaches customers and rapid learning in a high-velocity environment. You will join small, autonomous teams across Milan, London, Madrid or Warsaw, tackling real initiatives by investigating, innovating, testing, executing and iterating with AI, data and user research.
Verifichi qui sotto se possiede i requisiti per questa possibilità e, in tal caso, invii la sua candidatura il prima possibile.
During xlwpduy the initial months, most days will be spent in our Milan office to ramp up, with generous travel and
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