Photonics Packaging Engineer
Pubblicato il 12-09-2026 - Advanced Fiber Resources in Romano di Lombardia
AFR is investing in its PIC business by expanding the R&D; and Manufacturing Center in San Donato Milanese.
Per essere preso/a in considerazione per un colloquio, la preghiamo di assicurarsi che la sua candidatura sia pienamente in linea con le specifiche del lavoro riportate di seguito.
We are looking for an expert Packaging Engineer to join our growing development team. You will have the opportunity to work with skillful and highly motivated engineers developing thin film Lithium Niobate products for telecom, datacom and quantum photonics applications.
Job Responsibilities:
- Develop advanced electro-optical components and modules, with a focus on photonic and high-speed RF packaging solutions.
- Resolve technical challenges related to optical coupling, thermal management, and high-frequency electrical interconnects.
- Work closely with NPI engineers to develop automated manufacturing processes and test workstations.
- Contribute throughout all development phases, from concept definition and prototyping through product development, qualification, and manufacturing.
- Collaborate with internal teams and external suppliers to define technical requirements, specifications, and procurement requirements.
- Act as the company's mechanical design authority, establishing and promoting best practices across projects and product lines.
- Define project plans and technical deliverables to meet development schedules.
- Provide regular technical and project-status updates to management. xysqume
- Perform assigned responsibilities with a high degree of independence and under limited supervision.
Job Requirements:
- At least 5 years of professional experience in similar roles within a relevant industry
- Proven experience in the design and development of optical and electro-optical modules
- Proficiency in 3D modeling and CAD software, such as SolidWorks, Creo, or equivalent tools
- Solid understanding of photonics principles and devices, including optical modulators
- Good knowledge of backend assembly processes, including soldering, adhesive bonding, thermal curing, and UV curing
- Ability to work effectively in an international, cross-functional team environment and collaborate with employees at all organizational levels
- Nice to have: experience with Python scripting for data analysis, simulations or test development
- Strong communication and interpersonal skills, with a collaborative and team-oriented approach
- Fluency in English, both written and spoken
Our commitment:
Innovative work environment in a young, dynamic team
Compensation range: € 40.000-€ 55.000 based on experience
Additional benefits: € 9/day of buoni pasto; health fund covering medical expenses; employee welfare platform