17 set - Italia
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.
17 set - Bologna
Virtus Group SSD Fanball
17 set - Genova
Diablox
17 set - Portici
Call business
17 set - Ravenna
Ottica Dragoni