Senior Advanced Packaging & PDN Architect (2.5D/3D)

20 set - Turbigo
Axelera AI

pAxelera AI in Turbigo is seeking a Senior Advanced Packaging Power Delivery Engineer to shape silicon and packaging architecture for AI accelerators. You will manage power delivery design from on-die grids to package analysis. /ppThe ideal candidate has 7+ years of experience in the semiconductor sector, demonstrated knowledge in advanced packaging, and effective cross-functional collaboration skills. Join us and help innovate in a dynamic environment offering flexible working options. /p #J-18808-Ljbffr

Principal Business Trainer - Investments

21 set - Milano
Simcorp

Falegnam*

21 set - Macerata
Adecco Italia

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Senior Principal HF Analog Design Engineer (d/m/f) - Pavia, Lombardia, Italy

21 set - Pavia
Ams Italy

Tecnico Documentalista Impianti e Compliance

21 set - Milano
ICRI