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We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.
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Technical leader responsible for HF analog layout strategy for broadband optical communication ICs or comparable RF ICs
Lead layout architecture and floorplanning activities
Develop and enforce layout methodologies
Drive parasitic-aware implementations
Support design teams through sign-off
Mentor layout engineers
BSc or MSc in Electrical Engineering
10+ years RF/analog xrdztoy layout experience
HF analog layout for broadband optical communication ICs or comparable RF ICs, including high-speed receiver/transmitter interfaces
Matching, shielding and isolation
Advanced CMOS node experience, including FinFET and/or FD-SOI, is required
EM-aware layout methodologies
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