23 set - Milano
Microtech Global
ROLE: High Speed Signal Integrity EngineerFaccia clic su "Candidati" qui sotto per inviare la sua candidatura. Si assicuri che il suo CV sia aggiornato e di aver prima letto le specifiche del lavoro.LOCATION: Milan, ItalyAbout the RoleWe are working with a leading international R&D organisation at the forefront of next‑generation ICT hardware systems. Their advanced engineering team focuses on cutting‑edge hardware technologies, with particular strength in high‑speed interconnects, signal integrity (SI), and system‑level performance optimisation.This is an opportunity to take real ownership of signal integrity across the full design stack - from individual interconnects to complete system channels - while shaping the methodologies, tools, and workflows that enable high-performance, scalable hardware design.What You’ll DoIn this role, you will:Own end-to-end signal integrity analysis for high-speed channels, from early design through to validationOptimise PCB, package, and interconnect performance under real-world operating conditionsDevelop and maintain engineering tools, scripts, and automated workflows to improve team efficiency and reproducibilityBuild reusable electromagnetic modelling methodologies tailored to high-speed applicationsTranslate SI analysis into clear, actionable design guidelines that influence hardware development decisionsContribute to and shape the technical roadmap for high-speed interconnects, integrating insights from industry and researchWhat We’re Looking ForWe’re seeking engineers with strong fundamentals and a track record of delivering high-quality technical work.You will typically bring:A strong academic foundation in Electrical Engineering, Physics, or a related field,
supported by an advanced degree and/or 5+ years of industry experienceSolid understanding of signal integrity fundamentals, including:Interconnect modellingElectromagnetic (EM) theoryChannel metrics (eye diagrams, crosstalk, BER, TDR)Hands‑on experience with simulation tools such as HFSS, ADS, CST, COMSOL, SIwave (or similar), with the ability to assess result accuracy and identify numerical artefactsA software engineering mindset, with experience building tools or automation pipelines (e.G. Python), beyond ad‑hoc scriptingStrong communication skills in English, including technical reporting and cross‑functional collaborationWe also welcome candidates from adjacent domains (EM, RF, packaging, photonics, numerical modelling) who are motivated to specialise in signal integrity. xysqume Nice to HaveExperience delivering SI results on real high-speed hardware systemsKnowledge of high-speed interfaces (PCIe, Ethernet, DDR, SerDes)Exposure to statistical SI techniques (Monte Carlo, corner analysis, DoE)Background in advanced packaging or chip-package co‑designExperience with model order reduction, surrogate modelling, or ML applied to EM/SI problemsWhat’s on OfferOpportunity to work in a high-impact R&D environment on next‑generation technologiesA collaborative, technically driven team with strong growth potentialCompetitive compensation package:€60,000 - €75,000 base salary (depending on experience)Discretionary annual premio (up to 2 months' salary)Ongoing training and career development opportunities across Europe and internationallyEmployment under CCNL Telecommunications (Levels 6-7)Diversity & InclusionOur client is committed to building an inclusive workplace and welcomes applications from all qualified candidates, regardless of background.#J-18808-Ljbffr
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