Senior Advanced Packaging & PDN Architect (2.5D/3D)

27 set - Turbigo
Axelera AI

Axelera AI in Turbigo is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape silicon and packaging architecture for AI accelerators. You will manage power delivery design from on-die grids to package analysis.

The ideal candidate has 7+ years of experience in the semiconductor sector, demonstrated knowledge in advanced packaging, and effective cross-functional collaboration skills. Join us and help innovate in a dynamic environment offering flexible working options.

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Service Operations Controller & BI Analyst

28 set - Italia
Thyssenkrupp Elevator

Sales Account Commerciale — Auto Aziendale & Bonus Obiettivi

28 set - Ascoli Piceno
IN OPERA

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Underwriter (Roma)

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Michael Page

Mechanical Engineer for CAM Development (all genders)

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Ivoclar EMEA