28 set - Assago
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer - Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.
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29 set - Roma
Fondazione Lavoro
29 set - Roma
Randstad Italia
29 set - Trieste
Dipartimento della Funzione Pubblica
29 set - Arona
presta&camelia