01 ott - Italia
Informatica / Software
Bending Spoons invites outstanding students to join a multi-office internship program in Milan, London, Madrid, or Warsaw. From June to September 2027, you will work on real projects that reach customers and learn at a rate unmatched elsewhere.
Expect to investigate, innovate, test, execute, and iterate with world-class teams across product disciplines. We value reasoning, drive, teamwork, and English proficiency, and provide exceptional growth opportunities, with competitive pay and equity
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