Senior Package Layout Engineer — 2.5D/3D-IC Packaging Lead

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/85fcvo

Annapurna Labs, an Amazon AWS organization, is seeking a Sr. Package Layout Engineer to lead end-to-end physical design of advanced IC packages for AI silicon and data center ASICs.

Scopra esattamente quali competenze, esperienze e qualifiche sono necessarie per avere successo in questo ruolo prima di candidarsi.
You will own layout from floor planning through tape-out, collaborating with silicon, SI/PI, thermal, and manufacturing teams to meet performance and reliability targets. Responsibilities include driving 2.5D/3D xbvzest packaging architectures, RDL/substrate routing, cross‑level optimization, and coordination with OSAT

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/85fcvo