Senior Package Layout Engineer — 2.5D/3D-IC Packaging Lead

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/862135

Annapurna Labs, an Amazon AWS organization, is seeking a Sr.

Package Layout

Engineer to lead end-to-end physical design of advanced IC packages for AI silicon and data center ASICs. You will own layout from floor planning through tape-out, collaborating with silicon, SI/PI, thermal, and manufacturing teams to meet performance and reliability targets.

Responsibilities include driving 2.5D/3D packaging architectures, RDL/substrate routing, cross‐level optimization, and coordination with OSAT

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/862135