pAnnapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.br/We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs. In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets. /p h3Key job responsibilities /h3 ul liExecute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release. /li liImplement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar). /li liSupport package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement. /li liPerform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers. /li liSupport die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface. /li liContribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers. /li liAssist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams. /li liRun physical verification checks (DRC, connectivity, shorts/opens) and support design closure. /li liFollow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.

/li liCollaborate with SI/PI engineers to incorporate electrical constraints into the physical layout — impedance-controlled routing, power plane optimization, and critical net shielding. /li /ul h3Basic Qualifications /h3 ul liBachelor's degree in Electrical Engineering or a related field /li li5+ years of experience in IC package layout and physical design /li liExperience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers /li liHands-on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent /li liUnderstanding of advanced packaging technologies: 2.5D/3D-IC, fan‑out WLP, RDL, TSV, microbump, or silicon bridge interconnects /li liWorking knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks) /li liExperience with bump map and ball map definition, escape routing strategies, and power/ground plane design /li liGood communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams /li /ul h3Preferred Qualifications /h3 ul liMaster's degree in Electrical or Communications Engineering or a related field /li liExperience with formal verification techniques including abstraction and end‑to‑end checking /li liExperience with ARM and various DSP ISAs /li liExperience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or related broadband wireless standards /li liExperience with industry standard tools and scripting languages (Python or Perl) for automation /li liMS with 3+ years in IC package layout and physical design /li liFamiliarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions /li liExposure to chiplet-based or heterogeneous integration packaging architectures /li liFamiliarity with package-level SI/PI concepts (impedance control,

PDN layout, crosstalk‑aware routing) sufficient to collaborate with SI/PI engineers /li liExperience developing automation scripts (Python, TCL, Skill, Ravel) for layout tasks or design rule checks /liliExposure to working with OSAT partners on NPI builds or yield improvement efforts /li liFamiliarity with high‑bandwidth memory (HBM) integration in advanced packaging contexts /li /ul pAmazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. /p pOur inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner. /p pThe base salary range for this position is listed below. Your Amazon package will include sign‑on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life ADD insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at /p pThe base salary range for this position is listed below. Your Amazon package will include sign‑on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life ADD insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at /p pUSA, AZ, Tempe - 153,600.00 - 215,000.00 USD annually /p #J-18808-Ljbffr

Package Layout Design Engineer, Annapurna Labs - AI Silicon Packaging

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