IC Package Layout Engineer - 2.5D/3D-IC Expert

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/879cxj

Annapurna Labs in AWS seeks a Package Layout Design Engineer to contribute to the physical design of advanced IC packages for AI/ML and data center ASICs.

È pronto/a a candidarsi? Si assicuri di aver compreso tutte le responsabilità e i compiti associati a questo ruolo prima di procedere.

You will drive floorplanning, routing, and tape-out coordination with ASIC, SI/PI, and manufacturing teams. xlwpduy

Lead aspects of 2.5D/3D-IC packaging, interposer design, and DFM compliance while advancing density, performance, and reliability targets in a fast-paced hardware environment.

#J-18808-Ljbffr

Vedi l’offerta su Go Lavoro: golavoro.it/annuncio-lavoro/879cxj