04 ott - Asti
Amazon
Annapurna Labs in AWS seeks a Package Layout Design Engineer to contribute to the physical design of advanced IC packages for AI/ML and data center ASICs. You will drive floorplanning, routing, and tape-out coordination with ASIC, SI/PI, and manufacturing teams.
Lead aspects of 2.5D/3D-IC packaging, interposer design, and DFM compliance while advancing density, performance, and reliability targets in a fast-paced hardware environment.
J-18808-Ljbffr
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