05 ott - Assago
TDK InvenSense
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer
Non aspetti a candidarsi dopo aver letto questa descrizione: per questa possibilità è previsto un elevato volume di candidature.
- Staff.
You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams.
Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging.
Strong communication and knowledge of semiconductor materials are essential. xysqume
This full-time role supports innovation in a dynamic environment.
#J-18808-Ljbffr
05 ott - Belpasso
d.t.s. dolciaria
05 ott - Taranto
OPENJOBMETIS
05 ott - Roma
optima srls
05 ott - Peveragno
CM DI TARICCO GABRIELE & C