Growth & Innovation Intern (AI-Driven Product)

05 ott - Milano
Informatica / Software

Bending Spoons invites outstanding students to join an internship program running from June to September 2027 in Milan, London, Madrid or Warsaw. You’ll own real work that touches customers and learn at a rapid pace in a high-velocity environment.
Throughout the internship you’ll investigate, innovate, test, execute and iterate with designers, engineers, and analysts to deliver tangible product improvements and learn from top talent across the company.

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