Software engineer, summer intern

09 ott - Milano
Bending Spoons

Questa posizione è in Bending Spoons

Il processo di selezione sarà interamente gestito Bending Spoons.

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At Bending Spoons, we’re striving to build one of the all-time great companies. A company that serves a huge number of customers. A company where team members grow to their full potential. A company that functions at unparalleled levels of effectiveness and efficiency. A company that creates value for shareowners at an extraordinary rate. And a company that does so while adhering to high ethical standards. In pursuit of this objective, we acquire and improve digital businesses, not to sell on, but to own and operate for the long term. The transformations we make are often deep—designed to speed up innovation, agevolazioni customers, and strengthen business performance. Here, hierarchy is minimal and teams are small and talent-dense. We operate established products with the ambition, agility, and urgency of a startup. Across the company, we integrate AI deeply into how we work so that human judgment and machine intelligence reinforce each other.



This internship for outstanding students runs from June to September 2027 in one of our offices in Milan, London, Madrid, or Warsaw . You’ll own real work that reaches customers and learn at a rate that’s hard to match elsewhere.
Responsibilities
- Build software that matters. Take real ownership from idea to production, creating systems used by millions and evolving them into products at scale.
- Amplify your impact with AI. Integrate the most powerful AI tools directly into your development workflow—design, implementation, testing, and documentation—to move faster while maintaining high standards for correctness, reliability, and maintainability.
- Master your toolkit. Work across diverse stacks with end-to-end ownership, choosing the right technologies for each challenge. From monoliths to microservices, gRPC to REST, Kubernetes to Docker, Python to Rust—you’ll apply technologies thoughtfully, focusing on depth and purpos

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